Pushing Beyond Traditional School and Course Boundaries: High School and University Students Collaborate on an Interdisciplinary Project
Document Type
Conference Proceeding
Publication Date
2007
Abstract
Aimed at promoting math, science, and technology education in elementary and secondary schools, K-12 students and their teachers have participated in a variety of outreach programs. However, the majority of these programs have focused on small-scope projects which do not expose students and teachers to a range of CSET fields, but rather to specific CSET technologies and concepts. In this paper we present a case study of a collaboration between Williamstown High School and Rowan University students, teachers, and faculty. In the context of a college-level software engineering course, we exposed all those involved to a variety of CSET disciplines and experts, including mechanical engineering, electrical engineering, software engineering, computer science, and robotics. Student reaction to the project was positive, and several interesting findings are presented. Active or observing roles could be assigned to the participants, depending on the scope, goals, duration, and availability.
Publication Title
2007 37th Annual Frontiers In Education Conference - Global Engineering: Knowledge Without Borders, Opportunities Without Passports(FIE)
Repository Citation
Rusu, Adrian; Rusu, Amalia; Kay, Jennifer; and Zhang, Hong, "Pushing Beyond Traditional School and Course Boundaries: High School and University Students Collaborate on an Interdisciplinary Project" (2007). Engineering Faculty Publications. 230.
https://digitalcommons.fairfield.edu/engineering-facultypubs/230
Published Citation
Rusu, Adrian, and Amalia Rusu, Jennifer Kay, Hong Zhang, "Pushing beyond traditional school and course boundaries: High school and University students collaborate on an interdisciplinary project," 2007 37th Annual Frontiers In Education Conference - Global Engineering: Knowledge Without Borders, Opportunities Without Passports(FIE), Milwaukee, WI, 2007, pp. T2B-10-T2B-15. doi: 10.1109/FIE.2007.4417934
DOI
10.1109/FIE.2007.4417934
Peer Reviewed
Comments
Copyright 2007 IEEE
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